Powder Metallurgy Parts

• Pure Copper Electrode

  High-Conductivity Electrodes for Welding, Discharge & Power Applications

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• Tungsten Copper Thermal Substrate

  High-Density W–Cu Heat Spreading Substrates for Power & RF Devices

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• Laser Diode Heat Sink

  Precision W–Cu / Cu Heat Sinks for High-Power Laser Diode Packaging

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• Chip Heat Sink Base

  High-Conductivity Copper / W–Cu Bases for Semiconductor Chip Cooling

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• TO-Pedestal

  Tungsten–Copper & Copper Bases for TO-Can Power Device Packaging

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• High Power Heat Sink

  High-Density W–Cu / Cu Heat Sinks for High-Power Laser Cooling

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• Pump Laser Diode Cooler

  Precision Thermal Coolers for Pump Laser Diode Modules

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• EML / DFB Thermal Component

  High-Stability Cooling Components for EML and DFB Laser Packaging

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• RF Heatsink

  High-Conductivity Thermal Components for RF & Microwave Devices

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• Optical Transceiver Heat Spreader

  NEWLIFE Optical Transceiver Heat Spreaders are high-performance thermal management solutions engineered for high-speed optical modules, including QSFP, QSFP-DD, OSFP, and CFP series.

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• Microelectronic Mount

  NEWLIFE Microelectronic Mounts are engineered platforms that provide mechanical stability, thermal efficiency, and precise alignment for semiconductor chips, laser diodes, photonic sensors, and...

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• Tungsten Copper IC Packaging

  The NEWLIFE Tungsten Copper (W–Cu) IC Packaging Series is developed specifically for power semiconductor chips, RF amplifiers, microwave modules, and hermetic device carriers that require...

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