TO-Pedestal
TO-Pedestal

TO-Pedestal

Tungsten–Copper & Copper Bases for TO-Can Power Device Packaging
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Tungsten–Copper & Copper Bases for TO-Can Power Device Packaging

 

Key Features

 

  • High Thermal Conductivity: Ensures efficient heat dissipation for TO-package power devices.
  • Optimized CTE: Reduces thermal stress during die attachment and hermetic sealing.
  • High Strength & Stability: Maintains performance under continuous thermal loading.
product-1600-900
  • Precision Machined Surfaces: Supports stable soldering, brazing, and bonding.
  • Surface Compatibility: Ni/Au plating, soldering, and brazing-ready.
  • Long-Term Reliability: Withstands high-power and RF operational environments.
  • PM vs. Traditional Machining: Near-net-shape manufacturing reduces waste, post-processing, and improves density uniformity compared to milled or cast pedestals.
product-1600-900

 

Overview

 

NEWLIFE TO-Pedestals are critical thermal and structural components for TO-package power devices. Manufactured from W–Cu alloys or pure copper via PM sintering, infiltration, and precision CNC machining, these pedestals provide high thermal conductivity, controlled CTE, and superior mechanical strength, ensuring reliable heat conduction, hermetic sealing, and dimensional stability for TO-3, TO-5, TO-18, and TO-220 modules.

product-1600-900

Compared to traditional machined copper or tungsten components, PM-based W–Cu TO pedestals enable near-net-shape production of complex geometries, reducing machining time, material waste, and thermal distortion. NEWLIFE's proprietary powders provide uniform density, predictable thermal expansion, and long-term reliability, making these pedestals suitable for power transistors, diodes, photodiodes, high-power LEDs, and RF/microwave devices.

product-1600-900

 

Applications

 

  • TO-Package Power Transistors: Efficient thermal base for TO-3, TO-5, TO-18, TO-220 modules.
  • Diodes, Photodiodes & High-Power LEDs: Provides stable thermal and mechanical support.
  • RF & Microwave Components: Reliable heat conduction and hermetic sealing.
  • Sensor Modules: Bases for devices requiring hermetic and dimensional stability.
  • High-Power Electronics: Structural support and thermal management in compact packages.
product-1600-900

 

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