High-Conductivity Copper / W–Cu Bases for Semiconductor Chip Cooling
Key Features
- High Thermal Conductivity: Rapidly removes heat from ICs and chips.
- Low Warpage & Stable Flatness: Supports reliable die bonding.
- PM/MIM Near-Net Shape: Enables miniaturized, complex geometries with minimal machining.
- CTE Matching: Prevents thermal stress on sensitive devices.
- Mechanical Strength: Withstands repeated power cycling and thermal shock.
- Surface Compatibility: Suitable for electroplating, soldering, and wire bonding.
- PM vs. Machining: Reduces scrap, maintains uniform density, and enables geometries not feasible with milling or casting.
Overview
NEWLIFE Chip Heat Sink Bases are engineered to provide optimized thermal performance and structural stability for semiconductor chips and chip-on-board (COB) assemblies. Using PM, MIM, and high-precision CNC machining, these bases combine copper or W–Cu materials to deliver rapid heat removal, low warpage, and mechanical robustness, ensuring reliable die bonding and consistent thermal control.
Traditional machining often struggles with thin or miniaturized bases due to warpage, material waste, and limited geometry. PM/MIM near-net-shape technology enables production of compact, complex bases with cavities, steps, and multi-level surfaces, reducing cost and post-processing while maintaining tight tolerances. NEWLIFE's self-developed powders provide predictable thermal expansion, high density, and excellent mechanical strength for high-power ICs, MOSFETs, RF chips, and LED assemblies.
Applications
- Power ICs & MOSFET Modules: Efficient cooling and structural support.
- RF Chips & Telecommunications Devices: Maintains thermal and dimensional stability.
- LED & COB Packaging: Reliable heat dissipation in high-density assemblies.
- High-Performance Computing: Compact bases for CPUs, GPUs, and other high-power ICs.
- Industrial Electronics: Thermal management in critical embedded systems.
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